PlasmaPro80 RIE

The PlasmaPro 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control.
  • Open load design allows fast wafer loading and unloading
  • Excellent etch control and rate determination
  • Excellent wafer temperature uniformity
  • Up to 200mm wafers
  • Low cost of ownership
  • Built to Semi S2/S8 standards

Широкий спектр материалов может быть протравлен методом RIE:

1. Диэлектрики (SiO2, SiNx, etc.)
2. Кремний разных структур (Si, a-Si, poly-Si)
3. Полупроводники III-V групп (GaAs, InP, GaN, etc.)
4. Напыленные магнетроном способом металлы (Au, Pt, Ti, Ta, W, etc.)