Like the V2000 series production sputtering systems, the e2000 production evaporators are individually configured around the end user’s requirements.The e2000 systems take advantage of the latest technology, with a wide range of available options.
All systems are controlled by a PLC based Control System, via a built-in industrial PC or Human-Machine Interface (HMI).Datalogging of all major process parameters
- Substrate heating (up to 650°C)
- Single or multi-hearth e-beam guns (single up to 200cc capacity)
- Substrate fixturing systems include planetary & rotary motion
- Multi-boat thermal evaporation
- Deposition rate monitors & control systems
- Substrate cleaning and Ion assisted deposition
- Reactive gas admission
- Cryo pumping or Turbopump & Polycold for fast pumpdown
The PlasmalabSystem400 provides the ability to sputter metals, oxides, nitrides and silicides with film thicknesses from 20 nm up to several μm.