Physical Vapour Deposition
Physical
vapor deposition (PVD) is a variety of vacuum deposition and is a
general term used to describe any of a variety of methods to deposit
thin films by the condensation of a vaporized form of the material onto
various surfaces (e.g., onto semiconductor wafers). The coating method
involves purely physical processes such as high temperature vacuum
evaporation or plasma sputter bombardment rather than involving a
chemical reaction at the surface to be coated as in chemical vapor
deposition.
Plasmalab System400
The PlasmalabSystem400 offers the flexibility of dc, pulsed dc, rf and reactive magnetron sputtering for batch or single-wafer PVD processing in production or research & development