Plasma Etch & Deposition
The Plasmalab80Plus and Plasmalab800Plus tools offer versatile plasma etch and deposition solutions with convenient open loading in a compact, small-footprint system, making them easy to site and easy to use, with no compromise on process quality.
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Plasmalab 800Plus
A flexible solution for plasma etching and deposition processes on large wafer batches and 300 mm wafers, in a compact footprint, open-loading system. Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, applications, the Plasmalab800Plus can be configured for inductively coupled plasma (ICP) etching and deposition (ICP-PECVD), reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD).
Plasmalab System100
A flexible and powerful solution for plasma etching and deposition processes. The load-locked wafer entry allows fast wafer exchange, the widest range of process gases and an extended process temperature range.
Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, MEMS and microfluidics applications,
the PlasmalabSystem100 can have many configurations as detailed below.
Plasmalab System133
The PlasmalabSystem133 process tool offers 300 mm and large batch etch and deposition capability, with flexible configurations allowing ICP, RIE, PECVD and ICP-CVD (HD-PECVD) processes on a wide range of materials and device applications.
Plasmalab 80Plus
A flexible, compact and economical solution for plasma etching and deposition processes. Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, MEMS and microfluidics applications, the Plasmalab80Plus can be configured for inductively coupled plasma (ICP) etching and deposition (ICP-PECVD), reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD).
