Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology provides a range of high
performance, flexible tools to semiconductor processing customers
involved in research and development, and batch production.
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Atomic Layer Deposition (ALD) offers the opportunity to create precisely controlled ultra-thin films for advanced applications on nanometre and sub-nanometre scales, with conformal coating into high aspect ratio structures.
The Plasmalab80Plus and Plasmalab800Plus tools offer versatile plasma etch and deposition solutions with convenient open loading in a compact, small-footprint system, making them easy to site and easy to use, with no compromise on process quality.
Oxford Instruments offers a single tool, allowing the flexibility to perform etch and/or deposition and maximising system utilisation. System specifications can be closely tuned to applications, enabling faster and repeatable process results.
Physical vapor deposition (PVD) is a variety of vacuum deposition. The coating method involves purely physical processes such as high temperature vacuum evaporation or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.
Oxford Instruments offers a range of process solutions for nanostructure growth, taking in carbon nanotubes (CNT), silicon and other material nanowires, nanometre thin film deposition and III-V/II-VI/nitride semicondonductor epitaxial growth.
Oxford Instruments recently acquired Technologies and Devices Inc (TDI). Based at Silver Spring, Maryland, USA, TDI are a world leading company in the development of Hydride Vapour Phase Epitaxy (HVPE) processes and techniques for the production of novel compound semiconductors such as GaN, AlN, AlGaN, InN, InGaN. These materials are used in a variety of applications, the primary ones being solid state lighting, short wavelength optoelectronics and RF power electronics.
Oxford Instruments offers a unique family of de-processing solutions for Failure Analysis. These flexible failure analysis tools allow a whole range of processes from passivation removal to anisotropic oxide removal, from small die or packaged device through to 300 mm wafers.