Atomic Layer Deposition
Atomic
Layer Deposition (ALD) offers the opportunity to create precisely
controlled ultra-thin films for advanced applications on nanometre and
sub-nanometre scales, with conformal coating into high aspect ratio
structures.
Oxford Instruments’ ALD product family offers a unique new range of
flexibility and capability in the engineering of nanoscale structures
and devices by combining remote plasma ALD processes with thermal ALD.
FlexAL
Oxford Instruments’ FlexAL product family provides a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single system to deliver:
- Maximum flexibility in the choice of materials and precursors
- Low-temperature processes enabled by plasma ALD
- Low damage maintained by the use of remote plasma
- Controllable, repeatable processes via recipe-driven software interface
OpAL
OpAL introduces to the market a unique thermal ALD tool with a clear and easy upgrade route to plasma, allowing the combination of both plasma and thermal ALD in a single compact tool.
- Open loaded thermal ALD tool with plasma option
- Field upgrade available for plasma option
- Small wafer pieces up to full 200mm wafers – equally suitable for academic and industry R&DThermal and/or plasma chemistries